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Small plasma cleaner
PT-5S type is two-way gas input, stainless steel cabin: Φ150mm×270mm
Capacity: 5 liters
Power supply: AC220V
Working current: The working current of the whole machine is not more than 1.2A (excluding vacuum pump)
RF power supply: 300W
RF frequency: 40KHz or 13.56MHz Optional (offset less than 0.2KHz)
Frequency offset: less than 0.2KHz
Characteristic impedance: 50 ohms, automatic matching
Vacuum degree: 10Pa-1000Pa
Gas flow: 60-600ml/min (adjustable)
Process control: MCU automatic and manual mode
Cleaning time: 1-100 minutes adjustable
Power size 10%-100% adjustable
Dimensions: PT-5S type _400x450x250
Vacuum pump: 2XZ-4
Vacuum chamber temperature: less than 65 ° C
Cooling method: forced air cooling
[Plasma cleaning machine application and principle]
First, the metal surface is degreased and cleaned
Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing, and PVD, CVD coating, plasma treatment is required to obtain complete cleanliness and no oxidation. The surface of the layer. Plasma treatment in this case produces the following effects:
1.1 ashing the surface organic layer
- the surface will be chemically bombarded (oxygen below)
- Partial evaporation of contaminants under vacuum and transient high temperatures
- Contaminants are crushed under the impact of high energy ions and carried out by vacuum
- UV radiation destroys pollutants
Because plasma processing can only penetrate a few nanometers per second, the contaminated layer should not be too thick. Fingerprints also apply.
1.2 oxide removal
Metal oxides react chemically with process gases (below)
This treatment requires hydrogen or a mixture of hydrogen and argon. Sometimes a two-step process is also used. The first step is to oxidize the surface with oxygen for 5 minutes. In the second step, the oxide layer is removed with a mixture of hydrogen and argon. It can also be treated with several gases at the same time.
Typically, printed wiring boards are treated with a chemical flux prior to soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise it will cause corrosion and other problems.
Good bonding is often impaired by plating, bonding, and residue during soldering operations, and these residues can be selectively removed by plasma methods. At the same time, the oxide layer is also detrimental to the quality of the bond and plasma cleaning is also required.
Second, plasma etching
During the plasma etching process, the etched material becomes a gas phase by the action of the processing gas (for example, when etching with silicon using fluorine gas, the following figure). The process gas and matrix material are pumped out by a vacuum pump and the surface is continuously covered by fresh process gas. It is not desirable to cover the etched portion with a material (for example, the semiconductor industry uses chromium as a covering material).
The plasma method is also used to etch the surface of the plastic, and the mixture can be ashed by oxygen to obtain a distribution analysis. Etching methods are important as pretreatment means for plastic printing and bonding, such as POM, PPS and PTFE. Plasma treatment can greatly increase the bond wetted area.
Third, etching and ashing
PTFE cannot be printed or bonded without treatment. It is well known that the use of active alkaline metals enhances adhesion, but this method is not easy to grasp and the solution is toxic. Using a plasma method not only protects the environment, but also achieves better results. (The following figure)
The plasma structure maximizes the surface while forming an active layer on the surface so that the plastic can be bonded and printed.
Etching of PTFE mixture
The etching of the PTFE mixture must be carried out very carefully to avoid excessive exposure of the filler, thereby weakening the adhesion.
The process gases can be oxygen, hydrogen and argon. Can be applied to PE, PTFE, TPE, POM, ABS and propylene.
4. Surface activation and cleaning of plastics, glass and ceramics
Plastics, glass, and ceramics are as non-polar as polypropylene and PTFE, so these materials are processed before printing, bonding, and coating. At the same time, slight metal contamination of the glass and ceramic surfaces can also be cleaned by plasma. Plasma treatment does not damage the sample compared to the burning process. At the same time, the entire surface can be treated very evenly without toxic fumes, and hollow and slit samples can be processed.
· No need to pretreat with solvent
· All plastics can be applied
· Environmentally meaningful
· Take up very small work space
· low cost
The effect of the plasma surface treatment can be verified simply by using water, and the surface of the treated sample is completely wetted by water. For long periods of plasma treatment (greater than 15 minutes), the surface of the material is not only activated but also etched, and the etched surface has a wetting ability. Commonly used processing gases are: air, oxygen, argon, argon-hydrogen mixed gas, CF4, etc.
Fifth, plasma coating
In the coating, two gases enter the reaction chamber at the same time, and the gas is aggregated in a plasma environment. This application is more stringent than the requirements for activation and cleaning. Typical applications are the formation of protective layers for fuel containers, scratch-resistant surfaces, PTFE-like coatings, waterproof coatings, and the like. The coating is very thin, usually a few microns, where the affinity of the surface is very good. There are 3 cases commonly used
· Waterproof coating - cycline
· Coating similar to PTFE---fluorine-containing processing gas
· Hydrophilic coating---ethylene acetate
The small plasma cleaner has the advantages of low cost and flexible operation. Compared with large products with a price of more than US$100,000, the small plasma cleaning minicomputer has the following advantages:
1. It can operate more flexibly and easily change the type of processing gas and processing procedure.
2, will not cause any harm to the body of the person.
3. Its cost is negligible for plasma processing methods.
Small plasma equipment is widely used in plasma cleaning and surface modification. Through its treatment, it can improve the wetting ability of materials, enable a variety of materials to be coated, plated, etc., enhance adhesion, bonding force, and remove organic pollutants, oil or grease.
Its specific applications include:
1. Activation of plastic, glass and ceramic surfaces
Glass, ceramics, and plastics (such as polypropylene, PTFE, etc.) are essentially non-polar, so these materials are surface activated prior to bonding, painting, and coating.
2, metal degreasing and cleaning
Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing, and PVD, CVD coating, plasma treatment is required to obtain complete cleanliness and no oxidation. The surface of the layer.
Before the welding operation: Usually the printed circuit board is treated with chemical flux before soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise it will cause corrosion and other problems.
Before the bonding operation: good bonding is often weakened by residues during plating, bonding, and soldering operations, and these residues can be selectively removed by a plasma method. At the same time, the oxide layer is also detrimental to the quality of the bond and plasma cleaning is also required.
· Easy to operate and low cost
· High efficiency vacuum electrode
· Gas flow through the flow meter and needle valve for precise control
· Power can be adjusted within 200W (completely able to meet cleaning needs, more than 200W for etching)
· Automatic impedance matching
· Free setting parameters: processing time, power, gas, pressure
· Safety protection function: vacuum trigger, door lock
[Plasma cleaner application]
· Conventional cleaning methods do not completely remove the surface film of the material, leaving a very thin layer of impurities, and solvent cleaning is a typical example of this.
· The use of a plasma cleaner is to scrub the surface gently and completely by bombardment of the surface of the material by plasma.
• Plasma cleaning will remove invisible oil film, tiny rust and other such contaminants formed on the surface due to user exposure to outdoor exposure, etc., and plasma cleaning will not leave a residue on the surface.
· Plasma cleaners can handle a wide range of materials: plastics, metals, ceramics, and surfaces with varying geometries.
· The advantage of the plasma cleaner is that it not only cleans the dirt on the surface, but also enhances the adhesion of the surface of the material.
2. Polymer cleaning
1 polymer surface cleaning
· Plasma ablation mechanically removes the dirt layer by high-energy electrons and ions bombarding the surface of the material.
· Plasma surface cleaning removes dirt layers that may be present in certain processed polymers, unwanted polymer surface coatings and weak boundary layers
2 Surface reorganization of the polymer
• The inert gas used in plasma ablation destroys the chemical bonds on the polymer surface leading to the formation of free functional groups on the polymer surface.
• The free functional groups on the surface of the polymer re-bond to form the original polymer structure, also bond to free functional groups adjacent on the same polymer chain, or to free functional groups in the vicinity of different polymer chains.
· Polymer surface reorganization can improve the hardness and chemical resistance of the surface.
3 Surface modification of the polymer
• Plasma ablation destroys the chemical bonds on the polymer surface, resulting in the formation of free functional groups on the polymer surface.
· Based on the chemistry of the plasma process gas, the attachment of these surface free functional groups to the atoms or chemical groups in the plasma forms a new polymer functional group that replaces the old surface polymer functional group.
· Polymer surface modification can change the chemical properties of the material surface without changing the overall properties of the material.
4 polymer surface coating
· Plasma coating forms a thin plasma coating on the surface of the substrate by polymerization of the process gas.
· If the process gas used consists of complex molecules such as methane, tetrafluoride, carbon, then they will rupture in the plasma state, forming free functional monomers that will bond and resurface on the polymer surface. The compound is coated on the surface of the polymer.
· This polymer surface coating significantly changes the permeability and friction of the surface.
1. Disinfection and sterilization:
· Plasma disinfection has received a lot of recognition for the sterilization of medical devices.
· Plasma treatment has great potential for simultaneous cleaning and disinfection of medical devices.
· Plasma sterilization is especially suitable for the cleaning of medical instruments or dental implants and equipment for high temperature, chemicals, irradiation, allergies.
2. Increased adhesion
· The surface energy of many biomaterials is very low, making it difficult to effectively adhere and coat.
· Plasma surface activation leads to the formation of surface functional groups that will enhance the surface energy of the biomaterial and improve the adhesion of the interface.
· Most untreated biomaterials have very weak wettability (hydrophilicity).
· Plasma surface treatment can increase or decrease the hydrophilicity of many different biological materials.
· The surface can be made hydrophilic by plasma activation, and the surface can be water-repellent by plasma coating.
4. Low friction and barrier layer
· Some materials have a high coefficient of friction on ester and polymer surfaces, such as polyurethane.
· The plasma coating has a small coefficient of friction that makes the surface of the biomaterial smoother.
· Plasma coatings also form a dense barrier to reduce the permeability of liquids or gases to biological materials.
PT-5S Vacuum Plasma Cleaner: Plasma is often referred to as the fourth state of matter. The first three states are solids, liquids, and gases. They are relatively common and exist around us. Plasma is only present in certain environments on Earth, such as lightning and aurora. Just as it takes energy to convert a solid into a gas, it takes energy to produce it. A certain amount of ions consists of a mixture of charged particles and neutral particles (including atoms, ions, and free particles). The ion body is electrically conductive.
Application of plasma technology
By plasma bombardment of the surface of the object, the surface of the object can be etched, activated, cleaned, and the like. The adhesion and weld strength of these surfaces can be significantly enhanced. Plasma surface treatment systems are now being used for cleaning and etching LCDs, LEDs, ICs, PCBs, SMTs, BGAs, lead frames, flat panel displays. Plasma-cleaned ICs can significantly increase wire bond strength and reduce the likelihood of circuit failure. Residual photoresists, resins, solution residues and other organic contaminants are exposed to the plasma and can be removed in a short time. The PCB manufacturer's plasma etching system performs decontamination and etching to remove the insulation from the borehole. For many products, whether they are used in industry. In the electronics, aerospace, health and other industries, reliability depends on the bond strength between the two surfaces. Whether the surface is metal, ceramic, polymer, plastic or a composite thereof, the plasma has the potential to improve adhesion and improve product quality. The ability of the plasma to change any surface is safe, environmentally friendly, and economical. It is a viable solution to the challenges facing many industries.
Principle of plasma processing
A set of electrodes is connected to a radio frequency power source, and a high-frequency alternating electric field is formed between the electrodes. The gas in the region forms a plasma under the excitation of an alternating electric field, and the active plasma acts on the surface of the object to perform physical bombardment and chemical reaction. The surface material of the cleaning material becomes particles and gaseous substances, and is discharged by vacuuming to achieve the purpose of surface treatment.
Factors affecting plasma processing during the entire plasma processing process include process temperature, RF power, gas distribution, vacuum, electrode settings, electrostatic protection, etc. Small plasma cleaners